2601B-PULSE 10 µsec Pulser/SMU

Achieve high pulse fidelity without manual pulse tuning

The 2601B-PULSE’s control loop system eliminates the need to manually tune for load changes up to 3 μH, ensuring your pulse has no overshoot and ringing when outputting pulses from 10 μs up to 500 μs at any current level up to 10 amps. With pulse rise times < 1.7 μs, you can properly characterize your device or circuit under test.

• Output 10 A @ 10 V with a 10 μs pulse width
• Pulse rise time <1.7 μs to characterize with confidence
• High fidelity pulse output without tuning at any current level

Embedded scripting and connectivity for unmatched production throughput

Test Script Processor (TSP®) technology embeds and executes complete test programs inside the SMU instrument to deliver industry-best performance. TSP-Link® technology enables expansion of up to 32 TSP-Link nodes for creating high-speed, SMU-per-pin parallel testing without a mainframe.

• Eliminates time-consuming bus communications to and from the PC
• Advanced data processing and flow control
• Connect up to 32 TSP-Link nodes
• Reconfigure easily as test requirements change

Laser Diode (VCSEL) Production Test for ToF/LIDAR Applications

The ideal solution for laser diode vertical cavity surface emitting laser (VCSEL) LIV production testing, the 2601B-PULSE features a high speed and high accuracy 10 μs Pulser and SMU for both current pulse sourcing and voltage-current monitoring of VCSELs, VCSEL arrays, and laser diode modules. SMUs provide the most cost-effective LIV instrumentation with high system synchronization and throughput.

• Programmable pulse current source up to 10 A and 10 µs pulse widths
• Voltage and current measure resolution at 100 nV and 100 fA
• Built-in TSP® processing capability reduces PC-instrument bus communication

How to generate 10μs pulse with 2601B-PULSE System SourceMeter Pulse SMU Instrument
New Current Pulser / SMU Eliminates Time Consuming Manual Timing when Outputting Pulses as Low as 10 µs

Failure Analysis and Quality Assurance

Semiconductor companies and semiconductor researchers are constantly looking for ways to make devices fail to prevent them in the field. Semiconductor failure analysis (FA) engineers spend countless hours trying to understand why a device failed and how it can be prevented in the future.

• Streamline FA processes with SMU and Pulse testing
• Digital I/O to trigger external IR cameras
• Built-in timer function with 1 μs resolution and ±100 ppm accuracy.

Advancing Techniques of Failure Analysis Using Source Measure Units and Lock-in Thermography

On Wafer Semiconductor Testing

Keithley’s 2601B-PULSE and other Series 2600B System SourceMeter® SMU instruments combine the scalability and flexibility of rack-and-stack instruments with the integration and high throughput of mainframe-based systems, using TSP and TSP-Link technologies to reduce manufacturing footprint and cost of test. These instruments are routinely used in on-wafer semiconductor testing of laser diodes, LEDs, transistors, and so much more.

• Built-in TSP processing capability reduces PC-instrument bus communication
• TSP-Link up to 32 instruments at 500 ns synchronization with other Keithley TSP instruments

Automated Control from Lab to Fab

Keithley's Automated Characterization Suite (ACS) offers complete control of your equipment. Whether you need to control a few instruments on your bench, or automate an entire test rack for production, ACS offers a flexible, interactive environment for device characterization, parametric test, reliability test, and simple functional test.

• Perform simple 1-off tests or build complex project trees
• Code with Python inside ACS for unlimited flexibility and control
• Manual or automated wafer prober control
• Data management and statistical analysis capabilities

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